Results-driven manager with a strong background in project and quality management within the Contract Electronics Manufacturing (CEM) industry. Comprehensive knowledge of end-to-end manufacturing processes—from SMT and backend assembly to final testing. Proven track record in leading complex, global projects implemented under VDA 6.3 and IATF 16949 standards. Expert in cost breakdown analysis for PCBAs, box builds, and packaging. Highly customer-focused, with strong reactivity, clear communication, and a hands-on approach to solving critical issues quickly and effectively.
Skilled in risk assessment through PFMEA and Fault Tree Analysis (FTA), with deep experience supporting global teams in applying 8D methodologies in line with VDA 6.3. Additionally, as a branch manager of a global ESD packaging and equipment company, a recognized expert in antistatic protection of PCBAs, ensuring full compliance and reliability in sensitive electronic manufacturing environments.