Bhavani Prasad Yalagala
Glasgow,Scotland
Summary
Innovative expert in advanced packaging and heterogeneous integration, leading end-to-end assembly of 2.5D/3D SiP platforms. Specialises in high-density interconnects, nanofabrication techniques, and metrology using SEM, TEM, XRD, and AFM tools. Proficient in multi-physics modelling with COMSOL and MATLAB, ensuring system-level reliability. Experienced in supervising multidisciplinary teams and preparing facilities for industrial scale-up, driving innovation in high-performance AI and RF applications.
Overview
12
12
years of professional experience
Work history
Research Manager
University of Glasgow
Glasgow
2024.01 - 2026.02
- Advanced Packaging Facility Leadership: Serve as Research Manager for the ANALOGUE facility, acting as the technical authority for the installation, process characterisation, and maintenance of high-end tools, including automated/manual die bonders, wire bonders, and laser systems.
- 2.5D/3D Integration & TGV Development: Lead the R&D of disruptive interconnect solutions, specifically pioneering laser-based Through Glass Via (TGV) fabrication and microbump arrays using advanced printing technologies to enable next-generation heterogeneous integration.
- Comprehensive Backend Expertise: Execute and oversee the end-to-end assembly process flow, including precision dicing, grinding, wafer probing, flip-chip die bonding, and wire bonding, ensuring alignment with electrical and thermal performance targets.
- Validation & Failure Analysis: Perform advanced chip characterisation and reliability testing using state-of-the-art inspection tools like the Nordson Quadra 7 (X-ray) and bond testers to validate interconnect integrity and structural robustness.
- Process Optimisation & SPC: Develop robust assembly workflows and Design-for-Manufacturing (DFM) strategies, utilising Statistical Process Control (SPC) to optimise yields for complex System-in-Package (SiP) platforms.
- Team Supervision & Mentorship: Independently manage and train a multidisciplinary team of 4 PhD researchers and multiple technicians, ensuring strict adherence to cleanroom protocols and high-precision packaging standards.
Marie Curie ESR
Microelectronic Lab, James Watt School of Engineering, University of Glasgow
Glasgow
2021.01 - 2024.01
- Precision Nanofabrication & Thin-Film Processes: Expert in high-vacuum deposition and lithography, James Watt Nanofabrication Centre (JWNC), utilising electron beam metallization, RF/DC sputtering, and high-resolution photolithography to fabricate complex micro-devices and multi-layer interconnects.
- Nanoscale Device Engineering: Spearhead fabrication of nanowire-based memristor devices for neuromorphic computing; pioneered a novel Contactless Dielectrophoresis (DEP) roll-to-roll printing process to achieve precise alignment and integration of nanomaterials at scale.
- Advanced Metrology & Structural Analysis: Proficient in high-magnification characterisation and metrology, utilising Scanning Electron Microscopy (SEM), Energy Dispersive X-ray Spectroscopy (EDX), and surface profilometry to ensure dimensional accuracy and material integrity of nanodevices.
- High-Performance Device Development: Engineered Cryogenic Transistors for AI-driven high-performance computing and developed a 4096-element (64x64) flexible, biodegradable pressure sensor array, managing full fabrication cycle from material synthesis to large-area device integration.
- Cleanroom Protocol & Process Control: Maintain rigorous standards in Class 1000 cleanroom environments, applying statistical process control to optimise thin-film uniformity, etch selectivity, and yield for both silicon and non-traditional (flexible/biodegradable) substrates.
Ph.D.
Indian Institute of Technology (IIT), Hyderabad
Hyderabad
2018.01 - 2022.01
- Cleanroom-Based Nanofabrication & Device Modeling: Expert in high-resolution microfabrication at James Watt Nanofabrication Centre (JWNC), specialising in design, modelling, and cleanroom fabrication of semiconductor devices using E-beam lithography, Sputtering, and Electron Beam Metallization.
- Advanced Metrology & Material Characterisation: Proficient in high-precision metrology and structural analysis using Scanning Electron Microscopy (SEM), EDX, and surface profilometry to validate device geometry and material composition at the nanoscale.
- Novel Interconnect & Nano-joining Technologies: Pioneered a novel UV-Ozone-based treatment for nano-joining of 1D nanostructures, providing a specialised background in molecular-level bonding and interconnect integrity for advanced packaging.
- Advanced Material Synthesis (2D & Biomaterials): Synthesised and integrated novel 2D materials and biodegradable biomaterials (Silk Fibroin, Chitosan) for high-performance memristors, sensors, and photodetectors, demonstrating expertise in material science of flexible and sustainable electronics.
- Flexible & Neuromorphic Hardware Development: Directed full-cycle fabrication of nanowire-based memristors and large-area (64x64) sensor arrays, leveraging novel synthesised materials to drive innovation in neuromorphic computing and robotic E-skin applications.
Assistant Professor
Gudlavalleru Engineering College - AP, India
, AP
2014.01 - 2018.01
- Technical Mentorship & Capability Building: Acting as a technical authority at the University of Glasgow, supervising PhD, Master’s, and Bachelor’s researchers in advanced packaging workflows, ensuring high-level proficiency in cleanroom operations and assembly tools.
- Curriculum & Training Development: Designed and delivered advanced course modules for UG/PG subjects including Low Power VLSI Design, Digital IC Design, and Semiconductor Device Physics, bridging the gap between theoretical device modeling and practical fabrication.
- Strategic Lab Establishment: Proven track record in R&D facility management, including leading Board of Studies (BoS) meetings for curriculum alignment and managing MODROBs (AICTE) funded lab developments, encompassing equipment procurement, safety protocols, and facility readiness.
- Multi-Physics Modeling & Simulation: Expert in using COMSOL, LTSpice, and MATLAB to model and simulate the electrical and thermal behavior of semiconductor devices (FETs, Memristors, Amplifiers), directly supporting the validation of high-speed interconnect schemes.
- Resource & Proposal Management: Experienced in the independent preparation of major research proposals and grant applications (UGC/AICTE), securing funding for state-of-the-art lab infrastructure and advanced semiconductor research initiatives.
- Cross-Functional Leadership: Skilled in managing complex administrative and technical project lifecycles, from establishing safety protocols for electronic laboratories to coordinating multidisciplinary teams for curriculum and research development.
Education
Ph.D. - Microelectronics & VLSI
Indian Institute of Technology
Hyderabad, India 2018.01 - 1 2023
M.Tech. - VLSI design
VIT University
Vellore, India 2012.01 - 1 2014
B.Tech - Electronics & Communication Engineering
JNTUK University
India 2008.01 - 1 2012
Skills
- Senior Process Ownership & Heterogeneous Integration: Act as the technical authority for the ANALOGUE advanced packaging facility, managing the end-to-end assembly flow for 25D/3D SiP platforms Expertly utilize Advanced Die Bonders, Automated Wire Bonders, and Pico/Femto Lasers to develop high-density interconnects, including Through Glass Vias (TGV) and microbumps
- Next-Generation Interconnect R&D: Spearhead the development of disruptive packaging solutions using high-resolution printing (SIJ, XTPL) and laser-assisted processing Demonstrated success in achieving ultra-fine pitch interconnects and low-loss RDL wiring for high-performance AI and RF applications
- Advanced Nanofabrication & Thin-Film Mastery: Lead complex fabrication cycles within the James Watt Nanofabrication Centre, employing E-beam/Thermal evaporation, Sputtering, and Photolithography Expert in dry/wet etching and material synthesis (hydrothermal/sol-gel) to create functional 1D/2D device architectures
- Metrology, Characterisation & Failure Analysis: Drive technical DOEs and quality assurance using a suite of advanced metrology tools, including SEM, TEM, XRD, and AFM Utilise Nordson Quadra 7 (X-ray) and high-precision Bond Testers to perform rigorous failure analysis and validate structural integrity
- Multi-Physics Modelling & System Validation: Bridge the gap between design and fabrication by using COMSOL, MATLAB, and Cadence to model electrical and thermal behaviours Validated performance targets for FETs, memristors, and high-speed interconnects to ensure system-level reliability
- Leadership, Mentorship & Facility Readiness: Independently supervise a multidisciplinary team of PhDs and technicians, overseeing equipment procurement (Lapping machines, Parylene C deposition), safety protocols, and the training of junior engineers to ensure facility readiness for industrial scale-up
HONORS AND AWARDS
Successfully prestigious Marie Skłodowska-Curie (MSCA) ESR in 2021., Best poster award for the conference paper in IEEE conference in 2022., Secured Ministry of Human Resource and Development (MHRD) from Govt of India., Qualified in GATE exam 2016., Secured first prize in technical exhibition for the project “Autonomous Robot” in Vignan University 2010.
SCIENTIFIC PUBLICATIONS/PATENTS
- Yalagala, Bhavani Prasad, Parikshit Sahatiya, Chandra Sekhar Reddy Kolli, Shivam Khandelwal, Venkat Mattela, and Sushmee Badhulika. "V2O5 nanosheets for flexible memristors and broadband photodetectors." ACS Applied Nano Materials 2, no. 2 (2019): 937-947. (https://doi.org/10.1021/acsanm.8b02233).
- Yalagala, Bhavaniprasad, Shivam Khandelwal, J. Deepika, and Sushmee Badhulika. "Wirelessly destructible MgO-PVP-Graphene composite based flexible transient memristor for security applications." Materials Science in Semiconductor Processing 104 (2019): 104673.(https://doi.org/10.1016/j.mssp.2019.104673).
- Yalagala, Bhavaniprasad, Parikshit Sahatiya, Venkat Mattela, and Sushmee Badhulika. "Ultra-low cost, large area graphene/MoS2-based piezotronic memristor on paper: a systematic study for both direct current and alternating current inputs." ACS Applied Electronic Materials 1, no. 6 (2019): 883-891. (https://doi.org/10.1021/acsaelm.9b00086).
- Yalagala, Bhavani Prasad, Abhishek Singh Dahiya, and Ravinder Dahiya. "ZnO nanowires based degradable high-performance photodetectors for eco-friendly green electronics." Opto-Electronic Advances 6, no. 2 (2023): 220020-1. (https://doi.org/10.29026/oea.2023.220020).
- Yalagala, Bhavani Prasad, Sri Amruthaa Sankaranarayanan, Aravind Kumar Rengan, and Siva Rama Krishna Vanjari. "Biocompatible, flexible, and high-performance nanowelded silver nanowires on silk fibroin for transparent conducting electrodes toward biomemristor application." ACS Sustainable Chemistry & Engineering 10, no. 14 (2022): 4473-4485. (https://doi.org/10.1021/acssuschemeng.1c08227).
- Sarkar, Lisa, Bhavani Prasad Yalagala, Shiv Govind Singh, and Siva Rama Krishna Vanjari. "Electrodeposition as a facile way for the preparation of piezoelectric ultrathin silk film–based flexible nanogenerators." International Journal of Energy Research 46, no. 3 (2022): 3443-3457.(https://doi.org/10.1002/er.7393).
- Gunapu, DV Santhosh Kumar, Y. Bhavani Prasad, V. Sushma Mudigunda, Palguna Yasam, Aravind Kumar Rengan, Rajesh Korla, and Siva Rama Krishna Vanjari. "Development of robust, ultra-smooth, flexible and transparent regenerated silk composite films for bio-integrated electronic device applications." International Journal of Biological Macromolecules 176 (2021): 498-509. (https://doi.org/10.1016/j.ijbiomac.2021.02.051).
- Prasad, Bhavani, Kamaraju Maddu, and Venkata Lakshmi. "Mathematical Modelling and Analysis of Memristors with and without its Temperature Effects." International Journal of Electronics and Telecommunications 63, no. 2 (2017). (10.1515/eletel-2017-0024).
- Sarkar, Lisa, Mudigunda V. Sushma, Bhavani Prasad Yalagala, Aravind Kumar Rengan, Shiv Govind Singh, and Siva Rama Krishna Vanjari. "ZnO nanoparticles embedded silk fibroin–a piezoelectric composite for nanogenerator applications." Nanotechnology 33, no. 26 (2022): 265403. (10.1088/1361-6528/ac5d9f)
- Cerezo-Sanchez, Maria, Eve McGlynn, Stefania Bartoletti, Bhavani Prasad Yalagala, Beatrice Casadei Garofani, Arianna Capodiferro, Ewan Russell et al. "Bioresorbable Insertion Aids for Brain Implantable Flexible Probes: A Comparative Study on Silk Fibroin, Alginate, and Disaccharides." Advanced NanoBiomed Research (2023): 2200117. (https://doi.org/10.1002/anbr.202200117)
- Wang, Zhao, Bhavani Prasad Yalagala, Jungang Zhang, Mahshid Hafezi, Hadi Heidari, and Andrew Feeney. "Wireless and self-powered wearable pressure sensors based on chitosan for artificial mechanoreceptors." Advanced Materials Technologies (2025). https://doi.org/10.1002/admt.202401858
- McKinlay, Michael, Mahdieh Shojaei Baghini, Manuel Pelayo Garcia, Bhavani Yalagala, Hadi Heidari, Des Gibson, and Carlos Garcia Nuñez. "Study of triboelectric potential for tunable contact-electrification field effect transistors." IEEE Sensors Letters (2024).
- Zhang, Jungang, Venkatarao Selamneni, Bhavani Prasad Yalagala, Benjamin King, Jiaoran Wang, Luvsanbat Khurelbaatar, Carlos García Núñez, Mahmoud Wagh, Morteza Amjadi, and Hadi Heidari. "Laser-Engineered Interfacial Dielectrophoresis-Aligned Nanowire Networks for Transparent Electromagnetic Interference-Shielding Films." ACS nano (2025).
- Ge, Changhao, Bhavani Prasad Yalagala, Tahereh Masalehdan, Mahdieh Shojaei Baghini, Danijela Gregurec, and Hadi Heidari. "Large Area, Cost-Effective, and Ultra-Fast Fabrication of Mini-Coils Toward Noninvasive Magnetic Applications." Advanced Engineering Materials 27, no. 21 (2025): 2051102.
- Imroze, Fiheon, Bhavani Yalagala, Naveen Kumar, Mostafa Elsayed, Meraj Ahmad, Robert Graham, Vihar Georgiev, Hadi Heidari, and Martin Weides. "Cryogenic Neuromorphic Synaptic Behavior in 180 nm Silicon Transistors for Emerging Computing Systems." Advanced Intelligent Systems (2025): e202050506.
- Ding, Yuqi, Bhavani Prasad Yalagala, Haobo Li, Mohammed Waqas Mughal, and Hadi Heidari. "Physical reservoir computing for biomedical applications." Neuromorphic Computing and Engineering 5, no. 3 (2025): 032002.
- He, Qinrong, Huxi Wang, Jungang Zhang, Negin Ghahremani Arekhloo, Xenofon Karagiorgis, Bhavani Prasad Yalagala, Peter J. Skabara, Hadi Heidari, Dagou A. Zeze, and Ensieh S. Hosseini. "A Wearable and Highly Sensitive PVDF–TrFE–BaTiO3 Piezoelectric Sensor for Wireless Monitoring of Arterial Signal." ACS Applied Electronic Materials 7, no. 16 (2025): 7562-7571.
- Wang, Zhao, Bhavani P. Yalagala, Hadi Heidari, and Andrew Feeney. "Highly Sensitive Parylene C-Based Flexible Pressure Sensors for Wearable Systems." Small Science (2025): 2500081.
- Cerezo-Sanchez, Maria, Bhavani Yalagala, Eve McGlynn, Ewan Russell, Finlay Walton, and Hadi Heidari. "Flexible Neural Probe Modelling for Optimal Microelectrode-Tissue Interaction." In 2022 29th IEEE International Conference on Electronics, Circuits and Systems (ICECS), pp. 1-4. IEEE, 2022. (10.1109/ICECS202256217.2022.9971129).
- McGlynn, Eve, Bhavani Prasad Yalagala, and Hadi Heidari. "Microfabrication of Implantable, Flexible Neural Probes Towards Bidirectional Interfacing in the Deep Brain." In 2022 29th IEEE International Conference on Electronics, Circuits and Systems (ICECS), pp. 1-5. IEEE, 2022. (10.1109/ICECS202256217.2022.9971103).
- Yalagala, Bhavani Prasad, Sweety Deswal, Siva Rama Krishna Vanjari, and Ravinder Dahiya. "Flexible and ultra-fast bioresorbable nanofibers of silk fibroin-PVA composite." In 2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), pp. 1-4. IEEE, 2021. (10.1109/FLEPS51544.2021.9469701).
- Yalagala, Bhavani Prasad Babu, Harish, Ramana Reddy KV, and R. Dhanabal. "Comparative performance analysis of XOR-XNOR function based high-speed CMOS full adder circuits." In 2014 International Conference on Reliability Optimization and Information Technology (ICROIT), pp. 432-436. IEEE, 2014. (10.1109/ICROIT.2014.6798369).
- Prasad, Y. Bhavani, Ganesh Chokkakula, P. Srikanth Reddy, and N. R. Samhitha. "Design of low power and high speed modified carry select adder for 16 bit Vedic Multiplier." In International Conference on Information Communication and Embedded Systems (ICICES2014), pp. 1-6. IEEE, 2014. (10.1109/ICICES.2014.7034180)
- Wang, Zhao, Bhavani Prasad Yalagala, Hadi Heidari, and Andrew Feeney. "A Flexible and Self-Powered Chitosan-BaTiO 3 Composite Pressure Sensor for E-Skin Applications." In 2024 IEEE SENSORS, pp. 1-4. IEEE, 2024.
- Yalagala, Bhavani Prasad, Jungang Zhang, Rupam Das, and Hadi Heidari. "Advancements in Energy Harvesting for Implantable Cardiovascular Devices." In Wireless Power Technologies for Biomedical Devices, pp. 25-54. Cham: Springer Nature Switzerland, 2024.
- Imroze, Fiheon, Bhavani Yalagala, Meraj Ahmad, Mostafa Elsayed, Robert Graham, Giuseppe Colletta, Hadi Heidari, and Martin Weides. "Hysteresis-induced neuromorphic behavior in 180nm bulk PMOS devices at 3K." In 2025 IEEE 37th International Conference on Microelectronic Test Structures (ICMTS), pp. 1-4. IEEE, 2025.
- Yalagala, Bhavani Prasad, Jungang Zhang, Rupam Das, and Hadi Heidari. "Advancements in Energy Harvesting for Implantable Cardiovascular Devices." In Wireless Power Technologies for Biomedical Devices, pp. 25-54. Cham: Springer Nature Switzerland, 2024. [Book Chapter]
- Yalagala, Bhavani Prasad, and Hadi Heidari. "Triboelectric nanogenerators based on multilayered electrospun nanofibres." In Textile-and Fiber-Based Triboelectric Nanogenerators, pp. 275-307. Woodhead Publishing, 2026. [Book Chapter]
RESEARCH INTERESTS
- LSI backend specialist in semiconductor packaging and heterogeneous integration, leading R&D on advanced wafer-level processing (dicing, grinding, probing) and assembly (die/wire bonding, TSVs, microbumps). Expertise in 2.5D/3D interposer technologies and Through Glass Vias (TGVs) for high-density interconnects, driving innovation in AI/IoT and high-performance computing systems. Mentor teams in cutting-edge packaging tools to bridge R&D with industrial scalability.
- VLSI Backend & Semiconductor Packaging
- Micro and nanofabrication techniques inside cleanroom
- Advanced manufacturing techniques (printing, lasers)
- Biodegradable packaging for photonic systems
- Neuromorphic Hardware & Bio-inspired Systems
- High-Density Interconnect R&D
- Analog front end circuitry (Readout circuits)
- Expertise in 1D, 2D nanomaterials synthesis
PhD SUPERVISION/CO-SUPERVISION
- Student Name: Maria Cerezo Sanchez (PGR) Nationality: Spain University of Glasgow, Glasgow, UK Year Graduated: 2025 Status: Graduated PhD Title: Brain Implantable Transient Neural probes for Epilepsy treatment.
- Student Name: Changhao Ge (PGR) Nationality: China University of Glasgow, Glasgow, UK Year Graduated: 2025 Status: Graduated
- PhD Title: Wearable Microcoils for Magnetic Stimulation for the treatment of Neurological brain disorders.
- Student Name: Zhao Wang (PGR) Nationality: China University of Glasgow, Glasgow, UK Year Graduated: 2025 Status: Thesis writing PhD Title: Flexible and Self-Powered Pressure Sensors using Piezoelectric Nanogenerators for E-skin Applications.
- Student Name: Tala Masalehdan (PGR) Nationality: Iran University of Glasgow, Glasgow, UK Year Graduated: 2025 Status: 3rd Year PhD Title: Flexible and Self-Powered Pressure Sensors using Piezoelectric Nanogenerators for E-skin Applications.
FUNDING PROJECT & LEADERSHIP EXPERIENCE
- Successfully submitted more than 20 research proposals and actively participate in proposal writing for securing various funding for large grants from funding bodies in UK, including UK Research and Innovation (UKRI), Innovate UK, Engineering and Physical Research Council (EPSRC), European Research Council (ERC) etc.
- Successfully secured more than 3M Pounds and 180k Pounds as a Research Co-Investigator for the Strategic Equipment funding and other ERC funding like Pathfinder and accelerator.
- Established strong active collaboration with various parts of the world, including India (IITs, NITs), the UK, Germany, Italy, China, and United States.
- Acting as a Research Manager in the Microelectronics (MeLab) at the University of Glasgow for the last 4 years.
- Currently acting as an official Co-Supervisor for 4 PhD students in the Microelectronics Lab at the University of Glasgow.
- Acting as a reviewer for various IEEE conferences, reputed Journals from Wiley, ACS, and IoP etc.
- Involved in career development activities, lab purchase management, new equipment installation and training, cleanroom (JWNC) trainer for Photolithography, active in organising workshops, such as organising conferences, public speaking, lab management, and mentoring students.
References
References available upon request.
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Timeline
Research Manager
University of Glasgow
2024.01 - 2026.02
Marie Curie ESR
Microelectronic Lab, James Watt School of Engineering, University of Glasgow
2021.01 - 2024.01
Ph.D.
Indian Institute of Technology (IIT), Hyderabad
2018.01 - 2022.01
Ph.D. - Microelectronics & VLSI
Indian Institute of Technology
2018.01 - 1 2023
Assistant Professor
Gudlavalleru Engineering College - AP, India
2014.01 - 2018.01
M.Tech. - VLSI design
VIT University
2012.01 - 1 2014
B.Tech - Electronics & Communication Engineering
JNTUK University
2008.01 - 1 2012